Structure and method of fabricating high-density, trench-based non-volatile random access sonos memory cells for soc applications

ABSTRACT

The present invention provides two-transistor silicon-oxide-nitride-oxide-semiconductor (2-Tr SONOS) non-volatile memory cells with randomly accessible storage locations as well as method of fabricating the same. In one embodiment, a 2-Tr SONOS cell is provided in which the select transistor is located within a trench structure having trench depth from 1 to 2 μm and the memory transistor is located on a surface of a semiconductor substrate adjoining the trench structure. In another embodiment, a 2-Tr SONOS memory cell is provided in which both the select transistor and the memory transistor are located within a trench structure having the depth mentioned above.

FIELD OF THE INVENTION

The present invention relates to semiconductor memory devices andmethods of fabricating the same. More particularly, the presentinvention relates to two-transistor (2-Tr)semiconductor-oxide-nitride-oxide-semiconductor (SONOS) trench memorycells with randomly accessible storage locations and methods offabricating the same. The present invention provides 2-Tr SONOS trenchmemory cells wherein the select gate is located in a trench structureand the memory gate is located on a surface of a semiconductor substrateor wherein both the select gate and the memory gate are located in atrench structure.

BACKGROUND OF THE INVENTION

Conventional flash memory products employing floating gate technologies,where the memory state is represented by the charge stored in aninsulated, but conducting layer between the control gate electrode andthe device channel region, typically use programming voltages (i.e.,writing and erasing) of 10V or higher. Because of the necessity ofproviding high voltage levels for floating gate memory operation,integration of floating gate memories with complementary metal oxidesemiconductor (CMOS) is problematic. First, present CMOS power supplies(V_(dd)) are approaching 1V. At these low supply voltages, it isdifficult to provide high voltage levels necessary for floating gateoperation—even with the use of charge-pumping circuits. Presently, oneis forced to provide a separate high voltage supply for floating gatememories, e.g., 3.3V, and the use of charge-pumping circuitry, inaddition to a lower voltage supply source for any CMOS logic associatedwith the chip. For mobile applications, the high supply voltagesnecessary for conventional floating gate memories severely limit thebattery life. Moreover, there is a severe cost penalty of integratingfloating gate memories with CMOS—it is estimated that as many as nine(9) additional lithography steps may be necessary.

Randomly-accessible semiconductor-oxide-nitride-oxide-semiconductor(SONOS) (also referred to as metal-oxide-nitride-oxide-semiconductor(MONOS); note that the terms SONOS and MONOS denote basically the sametype of memory cell except that polysilicon is used as the SONOS gateconductor and a metal is used as the MONOS gate conductor) memory isconsidered a viable replacement to floating gate memories due to themoderate operating voltages these memories employ, e.g., approximately5V. In such memory cells, the memory state is represented by the chargestored in an insulator layer located between the control gate electrodeand the device channel region. Depending on the programming conditionsof the memory cells, it may be possible, for example, to lower the highvoltage supply from 3.3V to 1.8V or even do away with the separate powersupply altogether, thereby prolonging battery life. In addition, sinceSONOS memories typically utilize uniform tunneling for programming,reliability problems usually associated with floating gate memories,such as hot hole injection, are avoided.

However, SONOS cells are not immune to scaling concerns. The moderatevoltages needed for programming put limits on the transistor design onecan employ. Short-channel effects, including punch-through, can easilyoccur even at these voltages, if the device channel lengths are tooshort. Increasing channel doping concentrations to deter punch-throughcan lead to lower junction breakdown and destruction of any memorycapability.

The scaling of SONOS memory cells has been limited to planar devices.The select gate and memory gate are typically formed separately and thecell sizes of these types of cells are usually large. Recently, a SONOSplanar bit cell with a 0.157 μm² cell size designed in 90 nm groundruleshas been reported. See, for example, C. T. Swift, G. L. Chindalore, K.Harber, T. S. Harp, A. Hoefler, C. M. Hong, P. A. Ingersoll, C. B. Li,E. J. Prinz, J. A. Yater; “An embedded 90 nm SONOS nonvolatile memoryutilizing hot electron programming and uniform tunnel erase,” IEDM Tech.Dig., pp. 927-930, December 2002. Although smaller in size, the planarcell has its limits as the channel length may be more difficult to scalein the forthcoming generations. In addition, the planar ONO memory gatemust be constructed separately from any CMOS gate process. Additionalfour (4) masks are required above and beyond the CMOS process to createthe prior art SONOS cell array. Due to the necessity of separating theSONOS memory gate to CMOS processing, integration with high-performanceCMOS can become costly.

In view of the above, there is still a need for providing methods forforming high density SONOS memory cells that can be randomly accessedand programmed at lower voltages than prior art non-volatile memorycells.

SUMMARY OF THE INVENTION

The present invention provides non-volatile memory cells, i.e., SONOSmemory cells, whose area is less than prior art cells employing planarCMOS transistors. The present invention also provides non-volatile SONOSmemory cells that can be programmed at lower voltages than prior artcells. The present invention further provides non-volatile SONOS memorycells whose fabrication process is compatible with industry standardCMOS processes. The present invention even further provides SONOS memorycells that are an improvement over prior art SONOS and floating gateNVRAM cells.

Specifically, the present invention provides two-transistor (2-Tr) SONOSmemory cells with randomly accessible storage locations. In oneembodiment, the memory transistor is a planar device located on asurface of a semiconductor substrate, while the select transistor islocated within a trench structure that is present in the semiconductorsubstrate. In this embodiment of the present invention, a “shallow”trench structure (on the order of from about 1 to about 2 μm in depth)is used to serve as the select gate—or in other words—the cell's accessfield effect transistor (FET) lies along the vertical sidewall of atrench structure. Short-channel behavior of the select gate can beprevented as the trench depth, which determines the channel length ofthe cell, can be made larger without affecting the areal density of thecell. Because the select MOSFET is formed along the sidewall of atrench, its channel length is not constrained to scale with decreasingminimum feature size of successive technology nodes; however, the trenchcross-section dimensions can easily scale with the minimum feature sizeof the technology node, thus avoiding area penalty. It has beenestimated that a 2-Tr SONOS cell designed in a 65 nm logic library couldbe on the order of 0.15 μm²—this would be approximately 5× smaller thanany 2-Tr memory cell that is currently in the marketplace.

Additional benefits that are provided in the first embodiment of thepresent invention include: (1) the operation of the memory cell usesvoltages that are half that of present-day flash memories, which shouldprovide higher margin for oxide reliability of memory cells, (2)inherently superior read, e.g., disturb characteristics, compared to1-Tr NORs—as the memory FET is not biased during a read operation.Moreover, the number of additional masks needed to integrate the SONOStrench cells into CMOS is estimated to be a maximum of 4.

The trench structure is the key enabler in providing these much-reduced2-Tr SONOS cell sizes. However, unlike the trench structures in embeddeddynamic random access memory (eDRAM) technology, the depth for thetrench structure of the present invention is much shallower. The depthof the trench structure would only need to accommodate a channel lengththat would minimize detrimental short-channel effects; it is estimatedthat trench depths of about 0.5 μm to about 1.0 μm would be sufficientfor this purpose.

A second unique feature of the inventive cells is the manner in whichthe select gate is contacted. In order to keep the cell compact, a metalcontact is placed directly on the trench structure and is used tocontact the (trench) gate. A third feature unique to the presentinvention is the source-side diffusion for the trench. Here, the sourceof the trench select gate is placed at the very bottom of the trenchstructure and is contacted by a deep N-band implant (this is commonlyreferred to as a “common buried source”). Source control is provided atthe edges of the array through an N-diffusion guard ring that surroundsthe array and very much resembles the N-diffusion guard ring thatsurrounds an eDRAM array (to make contact to the buried plate).

Specifically, and in broad terms, the first embodiment of the presentinvention provides a non-volatile random access memory cell thatcomprises: a semiconductor substrate including at least one array regionthat contains a plurality of trench structures having a depth from about1 to about 2 μm, each trench structure including a select transistorhaving a channel located on vertical sidewalls of said trench structure,wherein selected trench structures are isolated by a trench isolationregion;

-   a source diffusion located beneath a bottom wall of each trench    structure; and-   a memory transistor comprising an oxide/nitride/oxide gate    dielectric located on a surface of said semiconductor substrate and    adjoining said selected trench structures.

In addition to the 2-Tr SONOS memory cell structure described above, thepresent invention also provides a method of fabricating the same. Inbroad terms, the method used in forming the non-volatile random accessmemory cell described above comprises:

-   forming a plurality of trench structures into an array region of a    semiconductor substrate, wherein each trench structure has a depth    from about 1 to about 2 μm;-   forming a source diffusion beneath each trench structure and forming    a vertical select channel along sidewalls of each trench structure;-   forming a select gate transistor within each trench structure;-   providing a trench isolation region between selected trench    structures; and-   forming a memory transistor including an oxide/nitride/oxide gate    dielectric on a surface of said semiconductor substrate, said memory    transistor is adjoining said selected trench structures.

In a second embodiment of the present invention, the memory transistorand the select gate transistor are both located within a trenchstructure that is formed into a semiconductor substrate. In thisembodiment, a SONOS memory trench memory cell is provided that can bescaled to approximately ½ the current SONOS cell sizes in the 65 nmlogic generation and only a single mask process above the CMOS processis used. Essentially, the SONOS trench memory cell described in thesecond embodiment decouples the standard CMOS process from theprocessing of the non-volatile random access memory storage and accesselements. The key enabler in this embodiment is that the select gate andthe memory gate are integrated with a trench structure. The trenchstructure typically has a depth, as measured from the top surface of thesemiconductor substrate to the bottom trench wall, from about 1 to about2 μm. The relatively shallow trench depth (as compared to 8 μm depths ofDRAM storage capacitors) easily accommodates both the select and memorytransistors which are relatively immune from short channel effects thatchallenge the CMOS logic devices. Here, the select gate is grown in abottom portion of the trench structure and the memory transistorcomprising an ONO film is formed in the upper portion of the trenchstructure. By allowing for the select and memory gates to be combinedwithin a trench structure, one can shrink the cell to cell sizes ofapproximately 0.07-0.09 μm² in the 65 nm logic technology. In addition,both the trench SONOS select gate and the memory gate formation can befully decoupled from normal CMOS processing—no special block masks areneeded to create different gate dielectrics and one could fully optimizememory cell functionality without compromising logic performance. Theimplementation of a trench SONOS cell into a CMOS logic technology wouldonly add one mask to the base logic process.

Specifically, and in broad terms, the second embodiment of the presentinvention provides a non-volatile random access memory cell thatcomprises:

-   a semiconductor substrate including at least one array region that    contains a plurality of trench structures having a depth from about    1 to about 2 μm, each trench structure including a lower portion    comprising a select transistor having a channel located on vertical    sidewalls of said trench structure, and an upper portion comprising    a memory transistor including an oxide/nitride/oxide gate    dielectric;-   a trench isolation region located between selected trench    structures; and-   a source diffusion located beneath a bottom wall of each trench    structure.

In addition to the 2-Tr SONOS memory cell structure described above, thepresent invention also provides a method of fabricating the same. Inbroad terms, the method used in forming the memory cell structuredescribed above comprises:

-   forming a plurality of trench structures into an array region of a    semiconductor substrate, wherein each trench structure has a depth    from about 1 to about 2 μm;-   forming a source diffusion beneath each trench structure and forming    a vertical select channel along sidewalls of each trench structure;-   forming a select transistor within a lower portion of each trench    structure;-   forming a memory transistor including an oxide/nitride/oxide gate    dielectric within an upper portion of each trench structure; and-   forming a trench isolation region between selected trench    structures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-6 are pictorial representations (through cross sectional views)illustrating the basic processing steps used in a first embodiment ofthe present invention for fabricating the inventive 2-Tr SONOS memorycell. In the first embodiment, the select gate is located within atrench structure and the memory gate is located on a surface of asemiconductor substrate that includes said trench.

FIG. 7 is a schematic showing a proposed cell array including Cells A-Dwhich are each comprised of the inventive 2-Tr SONOS cells provided bythe processing steps shown in FIGS. 1-6.

FIGS. 8-10 are pictorial representations (through cross sectional views)illustrating the basic processing steps used in a second embodiment ofthe present invention for fabricating the inventive 2-Tr SONOS memorycell. In the second embodiment, the select gate and the memory gate areboth located within a trench structure that is formed within asemiconductor substrate.

FIG. 11 is a cell array layout (top-down view) including the inventive2-Tr SONOS memory cells shown in FIG. 10.

FIG. 12 is a pictorial representation (through a cross section view)illustrating an alternative 2-Tr SONOS memory cell that can be formedusing the second embodiment of the present invention.

FIG. 13 is a cell layout (top-down view) including the inventive 2-TrSONOS memory cell shown in FIG. 12.

DETAILED DESCRIPTION OF THE INVENTION

The present invention, which provides 2-Tr SONOS memory cells withrandomly accessible storage locations and methods of fabricating thesame, will now be described in greater detail by referring to thedrawings that accompany the present application. It is noted that thedrawings of the present application are provided for illustrativepurposes and thus the same are not drawn to scale.

First Embodiment

2-TR SONOS memory cell wherein the select gate is located within atrench structure and the memory gate is located on a surface of asemiconductor substrate including the trench structure.

The first embodiment of fabricating the inventive 2-Tr SONOS memory cellbegins with providing a structure 10 such as shown in FIG. 1 whichincludes at least one array region 100 and at least one region 102 thatlies to the periphery of the at least one array region 100. Region 102is referred to herein as an array periphery. The structure 10 shown inFIG. 1 comprises a semiconductor substrate 12 including a pad stack 14having a plurality of openings 16 on top of the substrate 12 in thearray region 100. In the array region 100, the structure 10 alsoincludes trench structures 18 that are located in the semiconductorsubstrate 12. It is noted that the semiconductor substrate 12 in theperiphery array region 102 is protected with a blanket layer of the padstack 14.

The semiconductor substrate 12 shown in FIG. 1 comprises anyconventional semiconductor material including, for example, Si, SiC,SiGe, SiGeC, Ge alloys, GaAs, InAs, InP as well as other III/V or II/VIcompounds semiconductors. The semiconductor substrate 12 may alsocomprise a layered semiconductor such as, for example, asilicon-on-insulator or a SiGe-on-insulator. Typically, thesemiconductor substrate 12 is a Si-containing semiconductor such as Si,SiGe, SiC, SiGeC, a silicon-on-insulator or a SiGe-on-insulator.

The pad stack 14 is comprised of at least two material layers includinga bottom pad oxide layer and an upper nitride pad layer. The individuallayers of the pad stack 14 are not shown in the drawings of the presentinvention. The thickness of the pad stack 14 may vary depending on thenumber of material layers within the stack. Typically, the overallthickness for a pad stack 14 including a pad oxide and a pad nitride isfrom about 20 to about 500 nm. In an exemplary embodiment, the pad oxidehas a thickness from about 5 to about 10 nm and the pad nitride has athickness from about 100 to about 200 nm.

The pad stack 14 is formed on the surface of the semiconductor substrate12 using one or more conventional blanket deposition techniques such as,for example, chemical vapor deposition (CVD), plasma enhanced chemicalvapor deposition (PECVD), evaporation, chemical solution deposition oratomic layer deposition. In addition to deposition processes, thevarious material layers of the pad stack 14 can be formed by thermaloxidation or thermal nitridation. A combination of the aforementionedtechniques can also be used.

After forming the pad stack 14 on the semiconductor substrate 12 in boththe array region 100 and the area periphery 102, an oxide hardmask (notshown) is then formed atop the pad stack 14 in regions 100 and 102. Theoxide hardmask is formed utilizing one of the techniques described abovefor forming the various material layers of the pad stack 14. Thethickness of the oxide hardmask may vary depending on the technique thatwas used to form the same. A typical thickness for the oxide hardmask isfrom about 20 to about 400 nm. A resist having trench openings (both ofwhich are not shown in FIG. 1) in the array region 100 is then formed bydeposition of a resist material and lithography. The lithographic stepincludes exposing the applied resist to a desired pattern (i.e., atrench pattern) of radiation and developing the exposed resist utilizinga conventional developer. After forming the resist having the trenchopenings, the pattern is first transferred to the oxide hardmaskutilizing an anisotropic etching process such as reactive ion etching,ion beam etching, plasma etching or laser ablation. The resist can beremoved after the trench pattern has been transferred to the oxidehardmask or it can remain on the structure during the transfer of thepattern from the hardmask to the pad stack 14 and then to thesemiconductor substrate 12 and thereafter removed, as described above.These later pattern transfer steps can be performed utilizing the sameetching process as described above. A plurality of trench structure 18(two of which are shown in FIG. 1) having a depth, as measured from theupper surface of the semiconductor substrate 12, from about 1 to about 2μm, are formed into the semiconductor substrate 12 in the array region100.

After the trench structures 18 have been formed in the array region 100,and if not previously removed, the oxide hardmask used to define thetrench structures 18 is removed utilizing a conventional strippingprocess that selectively removes oxide, stopping on the nitride surfaceof the pad stack 14.

Next, the cell's source diffusion 20 and select gate channel 22 can beformed by ion implantation processes. The structure after these twoimplants have been performed is shown in FIG. 2. As shown, the sourcediffusion 20 is formed in the semiconductor substrate 12 about theexterior bottom wall of the trench structure 18, while the select gatechannel 22 is formed into the semiconductor substrate 12 about theexterior sidewalls of each trench structure 18.

The order of the implants used in forming the source diffusion 20 andthe select gate channel 22 is not critical to the present invention.Typically, however, the source diffusion implant occurs prior to theselect channel implant.

The source diffusion 20 may be doped with an n-type dopant atom (i.e.,an element from Group VB of the Periodic Table of Elements, such as, forexample, P, Sb or As) or a p-type dopant atom (such as an element fromGroup IIIB of the Periodic Table Elements, such as, for example, In, Bor BF₂). Typically, n-type dopants are used in forming the sourcediffusion 20. The implant energies used in forming the source diffusion20 is typically from about 10 to about 40 keV and ion doses from about1E15 to about 5E15 atoms/cm² are typically used to form a heavily dopedsource diffusion 20. Optionally, the sidewalls of the trench structure18 may be protected by a masking layer, such as a nitride spacer, duringthe implantation of the source diffusion 20. Since the dopantconcentration of the source diffusion 20 is much larger than that of theselect gate channel 22, the sidewalls may need to be protected to avoidcontamination of the channel by the source implant. The protectivespacers are removed prior to implantation of the select gate channel 22.

The select gate channel 22 has a polarity that is opposite to that ofthe source diffusion 20. Typically, the selected gate channel 22 isdoped with a p-type dopant. The select gate channel implantation isperformed utilizing an angle implantation process in which a tilt anglefrom normal incident of about 5° to about 10° is typically employed. Thechannel doping required for the select gate channel 22 is dependent onthe thickness of the gate dielectric to be subsequently formed in thetrench structure 18. An ion dose from about 1E13 to about 1E15 atoms/cm²is typically used for providing a range of threshold voltages (Vt) ofabout 0.3 to about 1.5V for a 10-15 nm gate dielectric.

Alternatively, an array doping process could be used to set the Vt ofthe select gate device. Typically, in standard bulk logic technologies,a triple well is usually created to define P-wells. These wells consistof a deep implant (250 to 350 keV), a medium implant (of about 150 keV)and a shallow implant (of about 50 keV).

After the implantation processes, a select gate dielectric 24 is formedalong each trench structure wall (e.g., bottom wall and sidewalls)utilizing a thermal growth process such as, for example, oxidation,nitridation and/or oxynitridation. Alternatively, a conventionaldeposition process such as CVD or PECVD can be used. The select gatedielectric 24, which is comprised of an oxide, nitride, oxynitride ormultilayers thereof, typically has a thickness from about 3 to about 15nm. Each of the trench structures 18 is then filled with a conductivematerial 26 and is recessed to the level of the semiconductor surface 12or slightly below the surface, e.g., from about 10 to about 20 nm belowthe surface of the semiconductor substrate 12. The resultant structureincluding the select gate dielectric 24 and the conductive material 26is shown, for example, in FIG. 3. It is noted that in this drawing,reference numeral 28 is used to define the select transistor that ispresent in each trench structure 18. The select transistor 28 includesthe vertical select gate channel 22, the select gate dielectric 24 andthe conductive material 26. Region 20 forms the source of the selecttransistor 28 and one of the diffusions of the memory transistor (to besubsequently formed) forms the diffusion of the select transistor 28.

The conductive material 26 comprises a metal, a metal alloy, a metalsilicide, polysilicon that is doped, or a combination thereof, includingmultilayers. Preferably, the conductive material 26 is polysilicon thatis doped with the same polarity as the source diffusion 20. Theconductive material 26 acts as the gate of the select transistor 28. Theconductive material 26 is formed utilizing a conventional depositionprocess. When doped polysilicon is used as the conductive material 26,it is preferred that an in-situ doping deposition process be employed.The recessing of the conductive material 26 is performed utilizing ananisotropic etching process such as reactive ion etching.

Once the select transistor 28 has been processed, trench isolationregions 30 are formed into the array region 100 and the periphery arrayregion 102 using conventional processes well known in the art including,for example forming trenches within the substrate 12 by lithography andetching, and filling the trench with a trench dielectric such as anoxide. Note that typically the depth of the trenches used in forming theisolation trenches is shallower than the trench structure 18 includingthe select transistor 28. In the drawing, the trench isolation region 30in the array region 100 separates two selected trench structuresincluding select transistors 28.

After the trench isolation regions 30 have been formed, array well 34 iscreated by a series of implants, such as p-type (B), implants through anopening in a resist mask (not shown in FIG. 4). The array well 34 istypically a Pwell in the embodiment illustrated. Another well region 35of opposite conductivity to the array well 34 can be formed at thispoint of the inventive process in region 102.

Another mask (also not shown) is then used to implant an N-band 36 (oralternatively P-band) that connects the source diffusions 20 beneatheach of the trench structures 18 including the select transistors 28.The N-band 36 (or the P-band) is typically formed using an energy ofabout 1 MeV and a ion dosage from about 1E13 to about 3E13 atoms/cm².

The array well 34 could also be used to set the channel doping of thetrench select gate device and the doping of the memory gate. The arraywell 34 is biased through contacts (to be subsequently formed) that lieon a p-diffusion guard ring (to be subsequently formed) that sitsoutside the array. The N-band 36/source diffusions 20 are biased throughcontacts that lie on an n-diffusion guard ring (to be subsequentlyformed) that sits adjacent to the p-diffusion guard ring. The array well34 is the only additional well mask in the present invention that isnecessary to set the SONOS cell device elements.

After other CMOS wells 35 have been processed (to set the channel dopingfor CMOS devices), a protective layer of silicon nitride is depositedand patterned with a non-critical block mask (a third unique mask) toexpose the array area 100, and to protect the periphery 102. The memorytransistor's gate dielectric 38 comprising an oxide-nitride-oxide (ONO)dielectric stack is then created. See, FIG. 5. The ONO dielectric stack38 typically consists of a bottom tunneling oxide having a thicknessfrom about 1.2 to about 3, preferably about 2, nm, a nitride layerhaving a thickness from about 5 to about 15, preferably about 7.5, nm,and a top oxide having a thickness from about 2.5 to about 7.5,preferably about 5, nm. The bottom tunneling oxide can be formedutilizing a conventional deposition process such as CVD or PECVD or athermal oxidation process can be used. The nitride layer of thedielectric stack 38 is typically formed by a deposition process such,for example, PECVD or low pressure chemical vapor deposition (LPCVD)process. The top oxide is typically formed by a deposition processincluding, for example, CVD or PECVD.

Next, a gate conductor 40 including a metal, metal alloy, metalsilicide, polysilicon or multilayers thereof is formed atop the ONOdielectric stack in array region 100 utilizing a conventional depositionprocess and patterned. See, the structure shown in FIG. 5. It is notedthat the gate conductor 40 is the gate of the memory transistor which islabeled by reference numeral 42 in the drawing.

With the memory transistor gates 40 having been formed, it is necessaryto remove the exposed ONO 38 and remaining regions of protective nitridefrom the periphery 102. This can be achieved with the application of anon-critical block mask, or with a maskless selective etch process if noother regions of nitride are present. If a masked process is used, aresist mask is provided that opens all CMOS areas and allows either wetor dry etch chemistries to remove the ONO and underlying protectivenitride layer, selective to the substrate 12. The resist is thenremoved. Having cleared the array periphery 102, gate dielectric for theCMOS logic transistors is formed, followed by deposition and patterningof gate conductor, using standard well known processes.

A dielectric cap (not shown) may optionally have been formed atop thegate conductor 40 and the logic gates in the array periphery 102. Asidewall spacer 44 is then formed on the sidewalls of the gateconductors by deposition and etching. Following these processes, onetypically proceeds with implant masks that allow for creation of CMOSnFET and pFET diffusions (including extensions) 46. Since the SONOSmemory transistor 42 is likely to be a device that operates under highervoltages than the accompanying CMOS, a separate array extension maskwould likely be necessary to separately dope the diffusion regions ofthe memory gate—this would be the fourth unique, and final, mask toinclude into the CMOS mask suite.

After the memory and CMOS diffusions have been created, the subsequentprocesses should follow the standard CMOS logic process including, forexample, formation of an intralevel dielectric 48, providing contactopenings in the intralevel dielectric 48, and filling the contactopenings with a conductive material 50 such as, for example, W or Cu.Prior to filling the opening with a conductive material 50, the exposedsurfaces can be silicided utilizing a conventional silicidation process.In FIG. 5, the silicide regions are labeled by reference numeral 52. Inembodiments, in which dielectric cap is not present atop the gateconductor 40, a silicide can be formed atop the gate conductor 40 if theconductor 40 is comprised of polysilicon.

It is noted that in FIG. 5, reference numeral 50BL denotes the bitlinecontact, reference numeral 50SGC denotes the select gate contact,reference numeral 50W denotes the well contact and reference numeral 50Bdenotes the N-band (or P-band) contact.

One unique feature of this cell is that the trench select gate iscontacted by a metal contact, e.g., conductive material 50. The memorygate contact 50 is exactly the same as the bitline contact 50BL and isprocessed simultaneously with the bitline contact 50BL. Two metal wiringM1 and M2 levels, as shown in FIG. 6, are necessary to complete thecreation of the SONOS memory array. Here, the memory gate is wired onthe first metal level and the bitline is wired on the second metallevel. The resultant structure is shown, for example, in FIG. 6. The M1and M2 levels are formed utilizing conventional processes well known inthe art. In the drawings, V1 refers to the conductively filled viabetween M2 and the BL contact 50BL. Reference numeral 54 denotesdielectric material and 56 denotes conductive material.

Electrical operations that may be performed on individual memory cellsin the memory array of the present invention will now be described. Thebasic programming operations of a SONOS cell are a) Write “0”, b) Write“1”/Erase “0”, c) Read “1” or Read “0”. These operations will now bedescribed by referring to FIG. 7 which is a schematic showing a proposedSONOS cell array including Cells A-D which are representative of the2-Tr SONOS memory cells described above.

a) Write “0”: In this operation it is desired to write a “0” into CellA. The bitline (Bit Line #1) attached to Cell A is biased at −5V, andits select gate 1 is boosted to −5V. The select transistor is in the offcondition, thus minimizing bitline loading. The memory gate of Cell A(Memory Gate Line #1) is boosted to +5V and the array Pwell and Nband(source) are biased to −5V. With these conditions, electrons are drivenby the high field between the bitline diffusion and the memory gate, andtrapped in the ONO of the memory cell. With electron injection into theONO, the Vt of the memory device should increase considerably and shouldprevent current flow when being read. Note that biasing the array well(Pwell) to −5V assures that no diffusion is forward biased, in additionto avoiding hole trapping in the ONO of inhibit cell D. Inhibit cells(B,C, and D) are all biased to minimize carrier trapping and/orde-trapping in the ONO dielectric: Bit Line #2 at +5V, Memory Gate Line#2 at −5V. Since the bitline and memory gate of inhibit Cells B and Care at the same voltage (+5V for B, −5V for C), they experiencenegligible electric field between gate and bitline diffusion, and notransfer of charge carriers to or from the ONO. The ONO of Cell Dundergoes negligible loss of trapped electrons since the field betweenits memory gate and bitline diffusion is diminished by the presence of alarge depletion region within the bitline diffusion (resulting from thebiasing polarity on cell D: Bit Line #2 at +5V, Memory Gate Line #2 at−5V). Furthermore, the −5V Pwell bias assures that the surface of thesilicon between source and drain of the memory transistor of cell D hasa low hole concentration, avoiding trapping of holes in its ONO.

b) Write “1” (or Erase “0”): To write a “1” into cell A, the BL isbiased at +5V and the select gate is boosted again to −5V; once againthe select transistor is off. The memory gate is boosted to −5V and thearray Pwell and Nband (source) are biased to +5V. With these biasingconditions in the selected cells, hole injection into the ONO from theaccumulated surface of the silicon between source and drain of thememory transistor is dominant. All cells sharing the same Memory GateSelect Line (e.g. Memory Gate Line #1) undergo the write “1”/eraseoperation, since all bitlines are at +5V. Once all cells on the sameMemory Gate Line are written “1”/erase, write “0” is performedselectively to produce the desired bit pattern. Since the array Pwelland memory gate (Memory Gate Line #2) of the inhibit cells (C and D) arebiased at +5V, relatively little band bending occurs in thesemiconductor under the memory gate. This assures that the field in theinhibit cells is too weak to alter their charge state.

c) Read: To read a “1” or “0” from cell A, the BL is biased at a lowervoltage (e.g. 1.5V) and the select gate is boosted to +5V. The memorygate, array well, and Nband (source) are grounded. For non-addressed(inhibit) cells, the bitline is floating and/or the select gate is zero,thus decoupling them from the bitline during the read operation. If asmall bitline current is detected, this means that the Vt of the memorydevice is relatively high, causing it to only weakly conduct, hence, a“0” (trapped electrons) has been written into the cell. If a relativelylarge current is detected, this means that the Vt of the memory deviceis negative (due to trapped holes in the ONO) and the device is on;therefore a “1” has been written into the cell (i.e. a depletion modeplanar memory device).

Second Embodiment

2-Tr SONOS wherein the select gate and the memory gate are both locatedwithin a trench structure that is formed into a semiconductor substrate.

This second embodiment of the present invention offers the followingadvantages: (1) The trench structure memory gate can be created prior toCMOS processing and can be truly integrated into CMOS processing. TheONO dielectric comes before the CMOS process and can be optimizedwithout degrading the CMOS device. (2) The trench structure memoryselect gate is structurally shallower than prior art eDRAM trenches (1-2μm tops) and it can be formed using simplified processing, e.g.,oxidation for the select gate, resist recess process, ONO formation anda one trench process (fill, planarization and recessing). (3) Extremelysmall cell sizes can be achieved (on the order of about 0.07 to 0.09μm².

The second embodiment of the present invention begins by utilizing theprocessing steps described above in forming the structure shown in FIG.2. In this embodiment, only array region 100 will be shown. Next, aselect gate dielectric 24 is formed along each wall of the trenchstructure 18 (sidewalls and bottom wall) utilizing a thermal growthprocess such as described above in connection with the first embodimentof the present invention. The select gate dielectric 24 is comprised ofone of the insulating materials described above and the thickness of theselect gate dielectric 24 is within the ranges described in the firstembodiment. The select gate dielectric 24 is shown, for example, in FIG.8. After forming the select gate dielectric 24, a resist (not shown inthe drawings) is formed within the trench structure 18 and the resist isrecessed from an upper portion 18 u of the trench structure (belowapproximately 0.5 μm from the upper surface of semiconductor substrate12) exposing the select gate dielectric 24 in the upper portion 18 u ofeach trench structure 18. The resist is formed utilizing a conventionaldeposition process and the recessing process comprises a timed reactiveion etching process that selectively removes a predetermined portion ofthe resist material. Next, and with the recessed resist present in eachtrench structure 18, the select gate dielectric 24 is removed from theupper portion 18 u of each trench structure 18 exposing bare sidewalls(i.e., semiconductor material) of the trench structure 18. The selectgate dielectric 24 is removed from the upper portion 18 u of each trenchstructure 18 utilizing an etching process such as an isotropic dry etchthat selectively removes the select gate dielectric stopping on the baresidewalls of the trench.

After removing the select gate dielectric 24 from the upper portion 18 uof each trench structure 18, the recessed resist is completely removedfrom each of the trench structures 18 by etching and thereafter an ONOdielectric stack 38 is formed within the trench providing the structureshown, for example, in FIG. 8. The ONO dielectric 38 is formed asdescribed above in the first embodiment, and it consists of a bottomtunneling oxide, a middle nitride layer and a top oxide. The bottomtunneling oxide is positioned on the bare surface of the trenchstructure 18 sidewall (within the upper portion of each trench) and theselect gate dielectric 24 in the lower portion of each trench structure18.

Next, and as shown in FIG. 9, each trench structure 18 is filled with aconductive material 26 such as described above in the first embodimentof the present invention. Preferably, the conductive material 26 that isformed into each trench structure 18 comprises doped polysilicon such asN+ doped polysilicon. The conductive material 26 is formed by depositionincluding an in-situ deposition process and a conventional planarizationprocess such as CMP is used. Note that in this embodiment, conductivematerial 26 is used as the gate material for the select transistor 28and the overlying memory transistor 40. After filling and planarization,at least one trench isolation region 30 is formed into the structure soas to isolate top portions of adjacent trench structures 18. The trenchisolation region 30 is formed as described above in the first embodimentof the present invention. After forming the trench isolation region 30,the pad stack 14 located atop the semiconductor substrate 12 is strippedutilizing a conventional stripping process that selectively removes padmaterial 14.

Next, and as illustrated in FIG. 10, diffusion regions 70 are formedinto the semiconductor substrate 12 adjacent to each trench structure 18utilizing a conventional ion implantation process followed by aconventional activation anneal. After forming the diffusion regions 70,an interlevel dielectric 48 having contact openings filled with aconductive material 50 is formed. The conductive material above thediffusion regions 70 is referred to as the bitline contact and thus thereference numeral 50BL is used to describe that region. The conductivematerial above the each trench structure 18 is referred to as the memoryselect gate conduct (or wordline) and thus the reference numeral 50MSGis used to describe that region. Additional dielectric materialscontaining conductive filled lines and vias are then formed utilizingstandard interconnect technology. In FIG. 10, reference numerals 72referred to an interlevel dielectric, reference numeral 74 refers toconductive regions, M1 is used to denote a first metal level and M2 isused to denote a second metal level.

In some instances, the select gate dielectric 24 can be removed from thebottom wall of the trench utilizing the following technique. Afterformation of the ONO in the trench, the array would be covered by aresist. The ONO and select gate are then reactively ion etched to openthe bottom of the trench for deep trench contacts. After stripping ofthe resist, the array and deep trench source line contacts aresimultaneously filled with conductive material 26.

The structure shown in FIG. 10 and described by the second embodiment ofthe present invention is referred to herein as e-tunneling one trenchSONOS memory cell. Note that is this embodiment, the memory select gatesrun parallel to DT source lines and bitlines run perpendicular to the DTsource lines and the memory select gates. A possible cell layout for thecell provided by the second embodiment of the present invention isshown, for example, in FIG. 11. Cells A-C are labeled and will bedescribed below in connection with the electrical operations.

Electrical operations that may be performed on each memory cell in anarray will now be described. The basic programming operations are a)Write “0”, b) Write “1”/Erase and c) Read “1” or “0”.

a) Write “0”: To write a “0” into Cell A shown in FIG. 11, the bitline(BL) is biased at

−5V, the memory select gate (MSG) is boosted to 5V and the array Pwellis biased to

−5V. With these conditions, electrons are driven by the high fieldbetween the inversion layer of the memory cell and the memory selectgate and they are trapped in the ONO of the memory cell portion of thetrench. There is negligible current through the channels of the selectand memory transistors because the bitline and the deep trench sourceline are both at −5V. Inhibit cells sharing the same boosted MSG (cellC) will not be programmed since they see a low field between the bitlinediffusion and memory select gate. Bitline current from cell C isrelatively small because the Pwell is biased at −5V. The presence of theselect transistor (thick gate dielectric) in series with the memorydevice avoids hot electrons from writing “0” to cell C. Additionally,inhibit cells sharing the same bitline (cell B), as the programmed cellwill not be written because their memory select gates are at −5V. Withelectron injection into the ONO, the threshold voltage of the memorydevice should increase considerably and should significantly reducecurrent when being read.

b) Write “1” (or Erase “0”): To write a “1” into cell A shown in FIG.11, the BL and the deep trench source line are biased to +5V. The memoryselect gate is biased to −5V, and the array Pwell is biased +5V. Withthese biasing conditions in the selected cells, hole injection into theONO is dominant while trapped electrons are injected back into thebitline diffusion of the memory device by the high field between memorygate and bitline diffusion. All cells sharing the same memory gateselect line (e.g., Cell C, memory gate select line 1) undergo the write“1”/erase operation. Once all the same memory gate line are written“1”/erase, write “0” is performed selectively to produce the desiredbitline pattern. Inhibit cell B is not erased, nor does channel currentflow, since its MSG, BL and deep trench source line are all at +5V.

c) Read: To read a “1” or “0” from cell A shown in FIG. 11, the BL isbiased at a lower voltage (e.g., 1.5V) and the memory select gate isboosted to +1.5V. The array well and the deep trench source line aregrounded. If no current is detected, this means that the thresholdvoltage if the memory device is too high to turn on and, hence, a “0”has been written into the cell. If current is detected, this means thatthe threshold voltage of the memory device is low (and quite likelynegative) and the device is on; therefore, a “1” has been written intothe cell (i.e., a depletion mode planar memory device). Neighboringinhibit cells can be grounded or even biased slightly negative topresent the gate from being turned on.

FIG. 12 shows an alternative embodiment to the second embodiment of thepresent invention in which a hot electron injection memory cell isformed. The alternative embodiment uses the same basic processing stepsas described above for the second embodiment of the present inventionexcept that no select gate dielectric is used. Instead, the ONOdielectric stack 38 is formed directly within each trench structure andprocessing proceeds as described in FIGS. 8-10 above. Note the ONOdielectric stack 38 is used as the gate insulating for both transistordevices.

The structure shown in FIG. 12 is referred to herein as a hot electroninjection one trench SONOS memory cell. Note that is this embodiment,the bitlines run parallel to the deep trench source lines; the MSG runsperpendicular to the deep trench source and bitlines. Furthermore, thecell contains a single vertical memory MOSFET (ONO) within the trench toserve the dual propose as a memory device and as a select device. Apossible cell layout for the cell provided by the second embodiment ofthe present invention is shown, for example, in FIG. 13. In the drawing,cells A-C are shown and will be described in connection with theelectrical operations described below.

Electrical operations that may be performed on each memory cell in anarray will now be described. The basic programming operations are a)Write “0”, b) Write “1”/Erase and c) Read “1” or “0”.

a) Write “0”: To write a “0” into cell A shown in FIG. 13, the bitline(BL) is biased at

+5V, and the deep trench source line is biased to ground. The memoryselect gate is boosted to +5V (or higher) and the array Pwell is biasedto 0V. With these conditions, hot electron injection occurs andelectrons rapidly get trapped in the ONO of the memory cell. Again,inhibit cells sharing a common boosted MSG (cell B) are not programmedsince their bitlines are at zero. Channel current in cell B is zerosince its Vds=0. Inhibit cells sharing a common bitline as theprogrammed cell (cell C) are not programmed since their MSGs are at 0V.With electron injection into the ONO, the threshold voltage of thememory device will increase to a value such that it can prevent channelcurrent when being read.

b) Write “1” (or Erase “0”): The erase condition for this mode issimilar to the erase mode described in the second embodiment. To write a“1”, the BL and the deep trench source line are biased at +5V. Thememory select gate is biased −5V and the array Pwell is biased to +5V.With these biasing conditions in the selected cells, hole injection intothe ONO is dominant while trapped electrons are injected back into thebitline diffusion of the memory device by the high field between thememory gates and the bitline diffusions. All cells sharing the samememory gate select line (e.g., cell B, memory select line 1) undergo thewrite “1”/erase operation. Once all cells on the same memory gate lineare written, “1/erase, write “0” is performed selectively to produce thedesired bitline pattern. Inhibit cells on the same bitline (cell C) arenot erased since they see MSG at +5V.

c) Read: To read a “1” or “0”, the bitline is biased at a lower voltage(e.g., 1.5V) and the memory select gate is boosted to +1.5V. The arraywell and the deep trench source line are grounded. If no current isdetected, this means that the threshold voltage of the memory cell istoo high to turn on and, hence, a “0” has been written into the cell. Ifcurrent is detected, this means that the threshold voltage of the memorydevice is low (and quite likely negative) and the device is on;therefore a “1” has been written into the cell (i.e., a depletion modememory device). Memory select gates of neighboring inhibit cells can beslightly negative to prevent gate turn on.

While the present invention has been particularly shown and describedwith respect to preferred embodiments thereof, it will be understood bythose skilled in the art that the foregoing and other changes in formsand details may be made without departing from the spirit and scope ofthe present invention. It is therefore intended that the presentinvention not be limited to the exact forms and details described andillustrated, but fall within the scope of the appended claims.

1. A non-volatile random access memory cell comprising: a semiconductorsubstrate including at least one array region that contains a pluralityof trench structures having a depth from about 1 to about 2 μm, eachtrench structure including a select transistor having a channel locatedon vertical sidewalls of said trench structure, wherein selected trenchstructures are isolated by a trench isolation region; a source diffusionlocated beneath a bottom wall of each trench structure; and a memorytransistor comprising an oxide/nitride/oxide gate dielectric located ona surface of said semiconductor substrate and adjoining said selectedtrench structures.
 2. The non-volatile random access memory cell ofclaim 1 further comprising a common buried source located in saidsemiconductor substrate that is in contact with each source diffusion.3. The non-volatile random access memory cell of claim 2 wherein saidcommon buried source is a N-band region.
 4. The non-volatile randomaccess memory cell of claim 1 wherein said select transistor comprises aselect gate dielectric on bare sidewalls of each trench structure and aconductive fill material, wherein said source diffusion is the source ofthe select transistor and a diffusion of the memory transistor is thedrain of the select transistor.
 5. The non-volatile random access memorycell of claim 4 wherein said conductive fill material is comprised ofdoped polysilicon.
 6. The non-volatile random access memory cell ofclaim 1 further comprising a select gate contact located on a surface ofsaid select gate transistor.
 7. The non-volatile random access memorycell of claim 6 wherein said surface of said select gate comprises asilicide.
 8. The non-volatile random access memory cell of claim 6wherein said select gate contact is in contact with a first metal level.9. The non-volatile random access memory cell of claim 1 wherein saidmemory transistor includes a diffusion region that is in contact with abitline through a bitline contact.
 10. The non-volatile random accessmemory cell of claim 1 further comprising an array periphery region nextto said at least one array region, said array periphery region includinga well region in said semiconductor substrate that surrounds said arrayregion that has a conductivity that is different from that of an arraywell region formed in said semiconductor substrate in said at least onearray region.
 11. A non-volatile random access memory cell comprising: asemiconductor substrate including at least one array region thatcontains a plurality of trench structures having a depth from about 1 toabout 2 μm, each trench structure including a lower portion comprising aselect transistor having a channel located on vertical sidewalls of saidtrench structure, and an upper portion comprising a memory transistorincluding an oxide/nitride/oxide gate dielectric; a trench isolationregion located between selected trench structures; and a sourcediffusion located beneath a bottom wall of each trench structure. 12.The non-volatile random access memory cell of claim 11 wherein saidselect transistor comprises a select gate dielectric on bare sidewallsof each trench structure in said lower portion and a conductive fillmaterial, wherein said source diffusion is the source of the selecttransistor and a diffusion of the memory transistor is the drain of theselect transistor.
 13. The non-volatile random access memory cell ofclaim 11 wherein said memory transistor further comprises a conductivematerial, wherein said conductive memory of said memory transistor isthe same as that of the select transistor, and said vertical channel ofsaid select transistor serves as the channel from the memory transistor.14. The non-volatile random access memory cell of claim 11 wherein saidsource diffusion is in contact with a diffusion of said memorytransistor through said vertical select channel.
 15. The non-volatilerandom access memory cell of claim 11 further comprising a select gatecontact located on a surface of said select gate transistor.
 16. Thenon-volatile random access memory cell of claim 15 wherein said selectgate contact is in contact with a first metal level.
 17. Thenon-volatile random access memory cell of claim 11 wherein said memorytransistor includes a diffusion region that is in contact with a bitlinethrough a bitline contact.
 18. The non-volatile random access memorycell of claim 11 wherein said oxide/nitride/oxide gate dielectric ofsaid memory gate is used as a gate dielectric for said selecttransistor.
 19. The non-volatile random access memory cell of claim 11wherein said select transistor has a gate dielectric that is differentfrom said oxide/nitride/oxide gate dielectric of said memory dielectric.20. The non-volatile random access memory cell of claim 11 furthercomprising a well region in said array region.
 21. A method of forming anon-volatile random access memory cell comprising: forming a pluralityof trench structures into an array region of a semiconductor substrate,wherein each trench structure has a depth from about 1 to about 2 μm;forming a source diffusion beneath each trench structure and forming avertical select channel along sidewalls of each trench structure;forming a select transistor within each trench structure; providing atrench isolation region between selected trench structures; and forminga memory transistor including an oxide/nitride/oxide gate dielectric ona surface of said semiconductor substrate, said memory transistor islocated adjoining said selected trench structures.
 22. The method ofclaim 21 wherein said source diffusion is formed by ion implantation andsaid select channel is formed utilizing an angle ion implant process.23. The method of claim 21 wherein forming said select transistorcomprising forming a select gate dielectric on bare sidewalls of eachtrench structure and then filling each trench structure with aconductive material.
 24. The method of claim 21 further comprisingforming a common buried source that contacts each diffusion source ofeach trench structure.
 25. The method of claim 21 further comprisingcontacting a diffusion of said memory transistor to a bitline through abitline contact and contacting the upper surface of the selecttransistor to a first metal level through a select gate contact.
 26. Amethod of forming a non-volatile random access memory cell comprising:forming a plurality of trench structures into an array region of asemiconductor substrate, wherein each trench structure has a depth fromabout 1 to about 2 μm; forming a source diffusion beneath each trenchstructure and forming a vertical select channel along sidewalls of eachtrench structure; forming a select transistor within a lower portion ofeach trench structure; forming a memory transistor including anoxide/nitride/oxide gate dielectric within an upper portion of eachtrench structure; and forming a trench isolation region between selectedtrench structures.
 27. The method of claim 26 wherein said sourcediffusion is formed by ion implantation and said select channel isformed utilizing an angle ion implant process.
 28. The method of claim26 wherein forming said select transistor comprising forming a selectgate dielectric on bare sidewalls of each trench structure and removingsaid select gate dielectric from an upper portion of each of said trenchstructures.
 29. The method of claim 26 wherein said oxide/nitride/oxidegate dielectric of said memory gate is also used as the select gatedielectric.
 30. The method of claim 26 comprising contacting a diffusionof said memory transistor to a bitline through a bitline contact andcontacting the upper surface of the select transistor to a first metallevel through a select gate contact.